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DATA SHEET
CLA Series: Silicon Limiter Diodes, Packaged and Bondable Chips
Applications
Limiters
Features
Established Skyworks limiter diode process High power, mid-range, and cleanup designs Low insertion loss: 0.1 dB @ 10 GHz Power handling to +66 dBm Tight control of I layer base width Mesa and planar chip designs
Description
Skyworks CLA series of silicon limiter diodes provides passive receiver protection over a wide range of frequencies from 100 MHz to over 30 GHz. These devices use Skyworks wellestablished silicon technology resulting in high resistivity and tightly controlled base width PIN limiter diodes. Limiter circuits using these devices perform with strong limiting action and low loss. The CLA series consists of nine individual chip designs of different intrinsic region base widths and capacitances designed to accommodate multi-stage limiter applications. The mesaconstructed, thin base width, low capacitance CLA4601-000, CLA4602-000, CLA4604-000, and CLA4605-000 are designed for low-level and cleanup applications. The CLA4603-000 and CLA4606-000 through CLA4608-000 are planar designs designated for high-power and mid-range applications. The CLA4609-000 thick base width mesa diode is designed for coarse limiter-stage applications. The absolute maximum ratings of the CLA diode series are provided in Table 1. Electrical specifications are specified in Table 2. Typical performance characteristics are provided in Table 3 and Figures 1 through 5. Table 4 identifies the die part numbers with their corresponding top contact diameters and die outline drawings. Table 5 identifies the hermetic part numbers together with their thermal resistance specifications and hermetic outline drawings.
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DATA SHEET * CLA SERIES DIODES
Table 1. CLA Series Absolute Maximum Ratings
Parameter Power dissipation Symbol PDIS Minimum Typical Maximum
Maximum TJ Case Temp Thermal Re sis tan ce junction to case
Units W
Reverse voltage Forward current Junction temperature Storage temperature
Note:
VR IF TJ TSTG -65 -65
Minimum rated breakdown voltage 200 +175 +200
V mA C C
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. CLA Series Electrical Specifications (Note 1) (TOP = +25 C, CJ Measured at 1 MHz, RS Measured at 500 MHz, CW Thermal Resistance for Infinite Heat Sink, Pulse Thermal Resistance for Single 1 s Pulse, Unless Otherwise Noted)
Breakdown Voltage (V) I Region (m) Junction Capacitance (CJ) @ 0 V (pF) Typical 0.12 0.20 0.20 0.12 0.20 0.20 0.20 0.80 0.26 Junction Capacitance (CJ) @ 6 V (pF) Maximum 0.10 0.15 0.15 0.10 0.15 0.15 0.15 @ 50 V 0.50 @ 50 V 0.14 Series Resistance (RS) @ 10 mA () Maximum 2.5 2.0 2.0 2.5 2.0 2.0 2.0 1.2 1.5 Minority Carrier Lifetime (TL) @ 10 mA (ns) Typical 5 5 5 7 7 10 50 100 1175 Thermal Impedance () Average ( C/W) 1 s Pulse ( C/W)
Part Number
Min - Max CLA4601-000 CLA4602-000 CLA4603-000 CLA4604-000 CLA4605-000 CLA4606-000 CLA4607-000 CLA4608-000 CLA4609-000 15 - 30 15 - 30 20 - 45 30 - 60 30 - 60 45 - 75 120 - 180 120 - 180 250 (Min.)
Nominal 1 1 1.5 2.0 2.0 2.5 7.0 7.0 28
Maximum 120 80 100 100 70 80 40 15 15
Typical 15 10 10 10 7.0 7.0 1.2 0.3 0.3
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Operation at elevated temperatures may reduce reliability of the device.
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DATA SHEET * CLA SERIES DIODES
Table 3. Typical Performance @ 25 C
Part Number CLA4601-000 CLA4602-000 CLA4603-000 CLA4604-000 CLA4605-000 CLA4606-000 CLA4607-000 CLA4608-000 CLA4609-000 Insertion Loss @ -10 dBm (dB) 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.2 0.3 Input Power for 1 dB Loss (dBm) 7 7 10 12 12 15 20 20 38 Maximum Pulsed Input Power (dBm) 47 50 50 47 50 53 60 66 70 Output @ Maximum Pulsed Input (dBm) 21 24 22 24 27 27 39 44 50 Maximum CW Input power (W) 2 3 2 3 4 3 6 15 20 Recovery Time (ns) 5 5 10 10 10 20 50 100 1000
Notes: Insertion loss for CLA4601-000 through CLA4607-000 @ 10 GHz. Insertion loss for CLA4608-000 @ 5 GHz. Insertion loss for CLA4609-000 @ 2.1 GHz. Limiter power results @ 1 GHz for shunt connected, single limiter diode and DC return in 50 line. Maximum pulsed power for 1 s pulse and 0.1% duty factor with chip @ 25 C heat sink. Derate linearly to 0 W @ 175 C. Maximum CW input power @ 25 C heat sink. Derate linearly to 0 W @ 175 C. Recovery time to insertion loss from limiting state.
Table 4. CLA Series Parts - Die Packages
Part Number CLA4601-000 CLA4602-000 CLA4603-000 CLA4604-000 CLA4605-000 CLA4606-000 CLA4607-000 CLA4608-000 CLA4609-000 Typical Top Contact Diameter (mils/mm) 1.10/0.028 1.25/0.032 2.00/0.050 1.65/0.042 2.05/0.052 2.25/0.057 3.50/0.089 7.50/0.190 6.50/0.165 Die Drawing 150-806 150-806 149-815 150-806 150-813 149-815 149-815 149-815 150-813
Table 5. Hermetic Packages
Hermetic Stripline Drawing CLA4601-240 CLA4602-240 CLA4603-240 CLA4604-240 CLA4605-240 CLA4606-240 CLA4607-240 CLA4608-240 CLA4609-240 Typical JC (C/W) 200 160 180 160 150 160 120 100 100 Hermetic Pill Drawing CLA4601-203 CLA4602-203 CLA4603-203 CLA4604-203 CLA4605-203 CLA4606-203 CLA4607-203 CLA4608-203 CLA4609-203 Typical JC (C/W) 150 110 130 130 100 110 70 45 45 Hermetic Pill Drawing CLA4601-219 CLA4602-219 CLA4603-219 CLA4604-219 CLA4605-219 CLA4606-219 CLA4607-219 CLA4608-219 CLA4609-219 Typical JC (C/W) 200 160 180 180 150 160 120 100 100 Hermetic Pill Drawing CLA4601-210 CLA4602-210 CLA4603-210 CLA4604-210 CLA4605-210 CLA4606-210 CLA4607-210 CLA4608-210 CLA4609-210 Typical JC (C/W) 140 100 120 120 90 100 60 35 35
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DATA SHEET * CLA SERIES DIODES
Typical Performance Characteristics at 25 C
+50
100
+40
Pulsed Thermal Impedance C/W Normalized to 1 s
CLA4607
Output Power (dBm)
+30 +20
CLA4606 CLA4604 CLA4603 CLA4601
CLA4608 CLA4607 10 CLA4601/2 CLA4606 CLA4603/4/5 1 1.00E-06 1.00E-04 1.00E-02 1.00E+00
+10
0
0
+10
+20
+30
+40
+50
+60
+66
Input Power (dBm)
Figure 1. Typical Peak Leakage Power @ 1 GHz
Pulse Width (sec)
Figure 2. Normalized Pulsed Thermal Impedance
0.5
+50
Bonding Wires
Peak Power Output (dBm)
50 CJ
Insertion Loss (dB)
0.4
Diode Chip RP 50
50
Diode 50 Chip
+40 CLA4607 +30 +20 +10 CLA4606 CLA4604 CLA4603 CLA4601
Single Diode Section
0.50 pF 0.30 pF
0.3 0.15 pF
0.2
0.1 0 2 4 6 8 10 12 14 16 18
0
0
+10
+20
+30
+40
+50
+60
+66
Frequency (GHz)
Figure 3. Typical Diode Insertion Loss vs Frequency
Peak Output Power Input (dBm)
Figure 4. Typical Peak Leakage Power @ 1 GHz
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DATA SHEET * CLA SERIES DIODES
Power Derating Factor
1.00 0.75 0.50 0.25
-50
0
+50
+100
+150
Case Temperature (C)
Figure 5. Power Handling Capability vs Temperature
Technical Description
The CLA4603 and CLA4606 limiter diodes are constructed in a passivated flat-chip configuration and are available in a basic chip form or encapsulated in several Skyworks hermetic ceramic packages. Limiter diodes with lower capacitance values to 0.08 pF and constructed with a passivated mesa configuration are available in the CLA4601 and CLA4605 series. The mesa devices offer low capacitance and, therefore, broader bandwidth, lower loss, and faster response at reduced power. These diodes are also available in chip package form and represent the ultimate in limiter performance not approached by other manufacturers. The CLA4607 diodes (highest power) are available in both planar and mesa construction. Figures 6 and 7 illustrate the fundamental structures of diodes mounted in a 50 microstrip circuit. Additional bonding and handling methods are contained in the Skyworks Application Notes, Waffle Pack Chip Carrier Handling/Opening Procedure (document #200146) and Diode Chips, Beam-Lead Diodes, Capacitors: Bonding Methods and Packaging (document #200146).
During the rise time of the incident pulse, the diodes behave in the following manner. The CLA4603, due to its thin I region, is the first to change to a low impedance. Experiments indicate that the CLA4603 reaches the 10 dB isolation point in about 1 ns and 20 dB in 1.5 ns with an incident power of 10 W. The CLA4606 takes about 4 ns and the CLA4607 about 50 ns to achieve 10 dB isolation. Consequently, the CLA4603 provides protection during the initial stages of pulse rise time with the thicker diodes progressively "turning on" as the power increases. With proper spacing (X1 and X2), the "on" diodes reflect high impedances to the upstream diodes, reducing the turn-on time for those diodes and ensuring that essentially all of the incident power is reflected by the input diode, preventing burnout of the thinner diodes. At the end of the pulse the process reverses and the diodes "recover" to their high impedance states; the free charge that was injected into their I regions by the high-incident power signal leaks off through the ground return and is also reduced by internal recombination. With a ground return, recovery time is on the order of 50 ns. With a high impedance return (for example, the circuit shown in Figure 10), the Schottky diode (such as the CDF7621-000) recovers or "opens" in practically zero time. Internal recombination on the order of several diode lifetimes is the only available mechanism for recovery of the limiter diodes. This recovery time can be long - on the order of 1 ms for the CLA4607 series. The shunt resistor (RR) minimizes the problem. One hundred Ohms approximately doubles the recovery time compared to a short circuit. When the Schottky diode is directly coupled to the transmission line in cascade after the coarse limiter, the leakage power is less than if a 0 ground return were used. If the Schottky is decoupled too much, the leakage power increases due to the high DC impedance of a Schottky. Similarly, a 3 ground return causes an increase of about 3 dB in leakage power compared to a 0 return.
Basic Applications
In microstrip limiters, the bonding wire length and diameter together with the chip capacitance, form a low-pass filter (see Figure 8). Line lengths (X1 and X2) are varied to provide broadband matching and flat leakage characteristics. Typically, X1 and X2 are on the order of 0.1 wavelength. In Figure 9, the CLA4607 chip provides about 20 dB attenuation, reducing a 1 kW input signal to a 10 W output signal. The CLA4606 reduces this to 100 mW and the CLA4603 to about 20 mW.
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DATA SHEET * CLA SERIES DIODES
50 Connector 0.020 in. Typ. 0.001 in. Gold Wire Bond, Typical
Ground Solder or Plane Epoxy Die Bond
Microstrip Board TFG 0.006 in. Thick, Typical
Figure 6. Diodes in 50 Microstrip Circuit (Side View)
Diode, Typical
TFG Board
Ground Return
X1
X2
50 Conductor 0.022 in., Typical
Figure 7. Diodes in 50 Microstrip Circuit (Top View)
Coil for Ground Return
X1 X2 CJ RP CJ RP
50
CJ
RR
50
Figure 8. Low-Level Equivalent Circuit
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DATA SHEET * CLA SERIES DIODES
RF
Ground Return <1
CLA4607 & CLA4609
CLA4606
CLA4603
Receiver
Figure 9. Cascaded Limiter Design
CLA4607 RR RF Schottky Barrier CDF7621 Receiver
Figure 10. Quasi-Active Limiter Design
Coil for Ground Return X1 50 RS RS X2 RS 50
Figure 11. High-Power Equivalent Circuit
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DATA SHEET * CLA SERIES DIODES
Package Outline Drawings
Package outline die drawings for the CLA diode series are shown in Figures 12, 13, and 14. Hermetic package outlines are shown in Figures 15 through 18. Die Packages
Schematic
1
Anode Top Contact, Gold 0.002 (0.050 mm) Dia. Min.
2
0.014 0.001 (0.325 0.025 mm)
0.014 0.001 (0.325 0.025 mm) 0.004 (0.010 mm) 0.006 (0.015 mm) Nom.
1
Cathode Metallized Back Contact, Gold
2 S1565
Figure 12. 149-815 Package
Schematic Anode Metallized Gold Dot 0.010 (0.251 mm) Min. 0.014 (0.356 mm) Max. Sq.
1
2
150-801: 0.002 (0.051 mm) Min. 150-806: 0.0011 (0.028 mm) Nom.
1
0.004 (0.127 mm) Min. 0.006 (0.152 mm) Max.
Silicon
2
Cathode Metallized Back Contact: Gold
S1567
Figure 13. 150 Series Package
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DATA SHEET * CLA SERIES DIODES
Die Packages (Continued)
Schematic
1
Metallized Gold Dot 0.002 (0.05 mm) Min. Dia. 0.014 0.001 ( 0.025 mm) 0.014 0.001 ( 0.025 mm)
2
Silicon Metallized Back Contact Gold
1
0.005 (0.13 mm) Nom.
S1566 2
Figure 14. 150-813 Package
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DATA SHEET * CLA SERIES DIODES
Hermetic Packages
Schematic
1
N-Type
1
0.050 (1.27 mm) 0.040 (1.02 mm)
2 2
0.055 (1.40 mm) 0.051 (1.30 mm) Dia.
S1569
Figure 15. -203 Package
Schematic
1
0.064 (1.63 mm) 0.060 (1.52 mm) 2 Places
0.124 (3.15 mm) 0.119 (3.02 mm) Dia.
2 1
0.025 (0.63 mm) Max.
0.225 (5.72 mm) 0.205 (5.20 mm)
0.097 (2.46 mm) 0.83 (2.11 mm)
2
0.064 (1.63 mm) 0.060 (1.52 mm) 0.083 (2.20 mm) 0.077 (1.95 mm)
S1570
Figure 16. -210 Package
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DATA SHEET * CLA SERIES DIODES
Hermetic Packages (Continued)
Schematic 1 0.075 (1.91 mm) 0.065 (1.65 mm) Sq. Cathode 0.020 (0.51 mm) Typ. 0.033 (0.84 mm) Min. 2
0.045 (1.14 mm) 0.030 (0.76 mm)
1 2
0.010 (0.24 mm) Ref.
S1564
Figure 17. -219 Package
Schematic 1 50 45 -011 (240) 0.175 (4.44 mm) 0.125 (3.18 mm) 2 Plcs. 2
0.098 (2.49 mm) 0.092 (2.34 mm) Cover Dia. Colored Dot Denotes Cathode
1
2
0.022 (0.56 mm) 0.018 (0.46 mm) 2 Plcs. 0.104 (2.64 mm) 0.092 (2.34 mm) Sq.
0.005 (1.27 mm) 0.003 (0.76 mm)
0.042 (1.06 mm) 0.028 (0.71 mm)
S1568
Figure 18. -240 Package
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DATA SHEET * CLA SERIES DIODES
Copyright (c) 2002 - 2009 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and "Breakthrough Simplicity" are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.
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